Aerosol Jet technology enables 3D printed electronics. Electronic components such as resistors, capacitors, antennas, sensors, and thin film transistors have all been printed with Aerosol Jet technology. The performance parameters of printed components, for example the ohm value of a resistor, can be controlled through printing parameters. Components can also be printed onto 3 dimensional surfaces eliminating the need for a separate substrate thereby reducing the size, thickness and weight of the end product. For example, Aerosol Jet is used to print antennas and sensors that conform to the shape of the underlying substrate such as a cell phone case.

The Aerosol Jet process supports printing on a wide variety of substrates including plastics, ceramics and metallic structures. Commercially available materials, such as nano-particle inks, have been optimized for the Aerosol Jet process to allow printing (and subsequent ink sintering) onto plastic substrates with low heat deflection temperatures.

Available in: Singapore, Malaysia, Thailand, Indonesia and Vietnam
Manufacturer's website : https://optomec.com/

Optomec Aerosol Jet Printing in High Rez on a Golf Ball

Optomec Aerosol Jet 3D Printed Electronics System

3D Printed Electronics Systems

Aerosol Jet 200 series

Aerosol Jet 200 Series Systems are a benchtop solution ideally suited for universities, ink developers, and others exploring the benefits of additive manufacturing for electronic and biologic applications.

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Optomec Aerosol Jet FLEX

The Aerosol Jet FLEX enables fine feature die/chip interconnects, component attach, and used in advanced R&D.

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Optomec Aerosol Jet 5X

The Optomec Aerosol Jet 5X enables fully printed antennas, sensors and MID.

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Optomec Aerosol Jet HD2

The Optomec Aerosol Jet HD2 enables a new generation in advanced packaging & assembly

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Optomec Aerosol Jet Print Engine

Designed for high-volume production environments, the Aerosol Jet Print Engine enables next-generation product process development to factory floor production of 3D advanced packaging, sensors, and circuits used in smart mobiles devices, automotive, medical and other electronic products.

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